Corsair Hydro Series H55 Quiet CPU Cooler - Liquid cooling system - ( LGA1156 Socket, AM2, LGA1366, AM3, LGA1155, LGA2011, FM1 ) - aluminium with copper base - 120 mm

Description

Hydro Series H55 is the easy cooling upgrade for your Intel CPU. The efficient. self-contained liquid cooling system is quieter and more efficient than stock CPU fans, and the compact design makes it ideal for smaller cases.

Special Features

• The easy CPU performance upgrade
• Great for smaller cases
• Self-contained cooling system
• Tool-free mounting bracket kit
• Low-noise, low-speed 120 mm fan
• Low permeability rubber tooling
• Low-profile pump
• Micro-fin copper cold plate with pre-applied thermal compound
• Low-profile black aluminum heat exchanger

Product features

• The easy CPU performance upgrade
  Your PC will run cooler and quieter when you replace your CPU's standard heatsink with a Hydro Series H55. Installation is straightforward: if you can get to the back of your PC's motherboard, you can install an H55. All you'll need is a screwdriver.
• Great for smaller cases
  The compact components and flexible tubing make Hydro Series H55 easy to install even if you're cramped for space. It allows you to improve your CPU's cooling efficiency even in most compact cases - as long as your case has a 120 mm fan mount near the CPU, H55 will probably fit.
• Self-contained cooling system
  Hydro Series H55 comes pre-filled, and never needs refilling or priming.
• Tool-free mounting bracket kit
  The modular design makes installation simpler, and it's compatible with Intel and AMD processors.
• Low-noise, low-speed 120 mm fan
  The low speed and wide diameter reduces noise levels over the smaller, faster fans used on stock CPU coolers. The three-pin connector is compatible with fan controllers.
• Low permeability rubber tooling
  Minimal coolant evaporation helps ensure long life, and the resilient rubber offers both high flexibility and excellent leak protection.
• Low-profile pump
  The pump unit provides high-speed circulation without taking a lot of space. This makes installation easier, and helps improve your case's airflow.
• Micro-fin copper cold plate with pre-applied thermal compound
  Copper has excellent thermal transfer characteristics, and the fin design is optimized for efficient heat exchange.
• Low-profile black aluminum heat exchanger
  The low-profile design reduces the airflow requirement, which helps make H55 quieter. The small size also allows for easier installation and improved compatibility, and the black finish looks great.